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BD62013FS ? product structure : silicon monolithic integrated circuit ? this product is not designed prot ection against radioactive rays . 1/20 tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 tsz22111 14 001 http://www.rohm.com for air-conditioner fan motor three phase brushless fan motor controller BD62013FS ? general description this controller synthesizes the optimal driving signal from hall sensor signals, and outputs the synthesized signal to control the external level shifter and power transistor. the replacement is also easy because of the almost pin compatible with bd62011fs, bd62012fs and bd62014fs, and this cont roller provides optimum motor drive for a wide variety of applications, and enables motor unit standardization. ? features ?? 150 commutation logic ?? pwm control (upper arm switching) ?? phase control supported from 0 to +30 at 1 intervals ?? rotational direction switch ?? fg signal output (12 pulses) ?? vreg output (5v/30ma) ?? protection circuits provided: ocp, tsd, uvlo, mlp and the external fault input (fib) ? applications ?? air conditioners; air cleaners; water pumps; dishwashers; washing machines ?? general oa equipment ? key specifications ?? supply voltage range: 10v to 18v ?? duty control voltage range: 2.1v to 5.4v ?? phase control range: 0 to 30 ?? operating temperatur e: -40c to 110 ?? power dissipation: 1.0w ? package w(typ.) x d(typ.) x h(max.) ssop-a24 10.00mm x 7.80mm x 2.10mm ? typical application circuit ssop-a24 r8 vreg vreg c5 hu hv hw vsp fg dtr vcc gnd m vdc BD62013FS bm620x r1 r2 r3 r4 r5 r6 r7 q1 c1 c2~c4 c6 c7 c8 c9 c10 c11 c12 c13 d1 c14 c15 fig.1 application circuit example - BD62013FS & bm620x
2/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? block diagram and pin configuration fig.2 block diagram fig.3 pin configuration ? pin descriptions pin name function pin name function 1 gnd signal ground 24 pct vsp offset voltage output pin 2 rt carrier frequency setting pin 23 pc phase control input pin 3 vcc power supply 22 vreg regulator output 4 rcl over current sense pin 21 hup hall input pin phase u+ 5 wl low side driver output phase w 20 hun hall input pin phase u- 6 wh high side driver output phase w 19 hvp hall input pin phase v+ 7 vl low side driver output phase v 18 hvn hall input pin phase v- 8 vh high side driver output phase v 17 hwp hall input pin phase w+ 9 ul low side driver output phase u 16 hwn hall input pin phase w- 10 uh high side driver output phase u 15 vsp duty control voltage input pin 11 fib external fault input (low active ) 14 fg fg signal output (12 pulses) 12 ccw direction switch (h:ccw) 13 hb hall bias output uh ul vh vl wh wl driver m 21 tsd hup 20 hun 19 hvp 18 hvn 17 hwp 16 hwn uvlo logic driver 10 9 8 7 6 5 vreg 22 vreg 3 vcc 4 filter 14 osc 1 gnd 15 vsp 23 2 hu hv hw fg 5 rcl 13 a / d pc pwm ccw 12 fib 11 vreg rt 2 test vdc 24 pct v/i + fault hb vsp gnd rt vcc rcl wl wh vl vh ul uh pct pc vreg hup hun hvp hvn hwp hwn vsp fib cc w fg hb
3/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? functional descriptions 1) commutation logic when the hall cycle is about 5hz or less (e.g. when the moto r starts up), the commutation mode is 120 rectangle drive with an upper and lower switching (no lead angle). the contro ller monitors the hall cycle, and switches to 150 commutation drive when the hall cycle reaches or exceeds about 5hz over four consecutive cycles. refer to the timing chart, figure 7 and 8. 2) duty control the switching duty can be controlled by forcing the dc voltage to the vsp pin, from v spmin to v spmax . when the vsp voltage is higher than v sptst , the controller forces pc pin voltage to t he ground (testing mode, the maximum duty and no lead angle). the vsp pin is pulled down internally by a 200k ? resistor. therefore, note t he impedance when setting the vsp voltage with the resistance voltage divider. 3) carrier frequency setting the carrier frequency setting can be freely adjusted by connecting an external resistor between the rt pin and ground. the rt pin is biased to a constant voltage, which determines the charge current to the internal capacitor. carrier frequencies can be set within a range from about 16khz to 50khz. refer to the formula to the right. 4) fg signal output the fg signal is output from the fg pi n, and it is generated from the three ha ll signals (exclusive nor, 12 pulses). 5) direction of motor rotation setting the direction of rotation may be switched with the ccw pin. when ccw pin is ?h? or open, the motor rotates for ccw directi on. when the real direction is different from the setting, the commutation mode is 120 rectangle drive (no lead angle). it is recommended to pull up to vreg voltage when malfunctioning because of the noise. 6) hall signal comparator the hall comparator provides voltage hyst eresis to prevent noise malfunctions. the bias current to the hall elements should be set to the input voltage amplitude from the elem ent, at a value higher than the minimum input voltage, v hallmin . we recommend connecting a ceramic capacitor from 100pf to 0.01f, between the differential input pins of the hall comparator. note that the bias to hall elements must be set within the common mode input voltage range v hallcm . 7) hall bias switch when the vsp voltage is higher than v sphb , the controller outputs vreg voltage to hb pin by an internal switch. a power saving is enabled at the motor rotation stop, by using hb outp ut for the hall elements bias current. in addition, since the hb output is supplied from the vreg power supply, take into consideration as load connected to the vreg pin, and be aware of the i omax value. table 1 120 commutation (six-state) truth table hu hv hw uh vh wh ul vl wl h l h l pwm l h pwm -------------------- l h l l l l pwm h l pwm -------------------- h h l l l pwm l h pwm -------------------- l h l pwm l l pwm -------------------- h l l h h pwm l l pwm -------------------- l h l l h l pwm l l pwm -------------------- h 400 f osc [khz] = r t [k ? ] ccw direction h ccw l cw
4/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 8) output duty pulse width limiter pwm switching duty pulse width limitation is provided to ens ure proper external level shifter and power transistor switching. because of the pulse wi dth limitation, the controller wi ll not output a pulse of less than t min (0.8s minimum), nor can it output a duty pulse of d max or more, because the controller does not keep the external power transistors full on. also, since the upper and lower external power transistors c annot be turned on simultaneously, the controller is shut off for the period t dt (1.6s minimum) at the upper and lower part of each phase output (for example, uh and ul). therefore, the switching maxi mum duty at the motor starts up is 90 percent (nominal). 9) phase control setting the driving signal phase can be advanced to the hall signal - (phase control). the lead angle is set by forcing the dc voltage to the pc pin. the input voltage is converted digitally with the 6-bit a/d converter, in which internal vreg voltage is assumed to be full-scale, and the converted data is processe d by logic circuit. the lead angle can be set from 0 to +30 at 1 intervals, and updated four th hall cycle of phase w falling edge. for the phase control function to operate is only 150 commut ation mode. however, the controller forces pc pin voltage to ground (no lead angle) when the testing mode. the vsp offset voltage (figure 29) is buffered to pct pin, to connect an external resistor between pct pin and ground. the internal bias current is determined by pct voltage and the resistor value - v pct / r pct -, and mix to pc pin. as a result, the lead angle setting is followed with the duty control voltage, and the performance of the motor can be improved. please select the r pct value from 50k ? to 200k ? in the range on the basis of 100k ? , because the pct pin current capability is a 100a or less. fig. 4 phase control setting example 1 fig. 5 phase control setting example 2 10) overcurrent protection (ocp) circuit the over current protection circuit can be activated by connec ting a low value resistor for current detection between the external output stage ground and the controller ic ground. when the rcl pin voltage reaches or surpasses the threshold value, the controller forces all the upper switching arm imports low (uh, vh, wh = l, l, l), th us initiating the overcurrent protection operation. when the rcl pin voltage swings below the ground, it is recommended to insert a resistor - 1.5k ? or more - between rcl pin and current detection resistor becau se of the malfunction prevent ion. since this protection circuit is not a latch type, it returns to normal operation - synchronizing with the carrier frequency - once the rcl pin voltage falls below the threshold voltage. a filter is built in to the overcurrent detection circuit to prevent malfunctions, so that the protection functi on does not activate when a short pulse of less than t rcl is input. 11) external fault signal input pin (fib pin, low active) the fib pin can force all controller driver outputs low at any time. the fib pin is pulled up to vreg internally by a 100k ? resistor, therefore, an open dr ain output can be connected directly. it is recommended to pull up to vreg voltage when this function is not used and malf unctioning because of the noise. l.a. vsp pc r pcl pct r pc t vsp adc l.a. r pc t v pct v spmin v pct = vsp-v spmin l.a. vsp pc r pcl pct r pc h vreg r pc t vsp adc l.a. r pc t v pct v spmin v pct = vsp-v spmin
5/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 12) thermal shutdown (tsd) circuit the tsd circuit operates when the junction temperature of the controller exceeds the preset temperature (175c nominal). at this time, the controller forces all driver outputs low. since thermal hy steresis is provided in the tsd circuit, the chip returns to normal operation when the junction temper ature falls below the preset temperature (150c nominal). the tsd circuit is designed only to shut the ic off to prev ent thermal runaway. it is not designed to protect the ic or guarantee its operation in the pres ence of extreme heat. do not continue to use the ic after the tsd circuit is activated, and do not use the ic in an environment where activation of the circuit is assumed. 13) under voltage lock out (uvlo) circuit to secure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage malfunctions, a uvlo circuit is built into this c ontroller. when the power supply voltage falls to v uvl or below, the controller forces all driver outputs low. when the voltage rises to v uvh or above, the uvlo circuit ends the lockout operation and returns the chip to normal operation. the voltage monitor circuit is built into for the vreg pin voltage (4.0v nominal) and hb pin voltage (3.5v nominal). therefore, the uvlo circuit d oes not release operation when either voltage rising is delayed behind the vcc voltage rising even if vcc voltage becomes v uvh or more. 14) hall signal wrong input detection hall element abnormalities may cause incorrect inputs that vary from the normal logic. when all hall input signals go high or low, the hall signal wrong input detection circuit forces all driver outputs low. and when the controller detects the abnormal hall signals continuously four times or more a motor rotation, the controller forces all driver outputs low and latches the state. it is releas ed that if the duty c ontrol voltage vsp is forced ground level once. 15) motor lock protect when the controller detects the motor locki ng during the fixed time (4sec. nominal, each edge of the hall signal doesn't input either), the controller forces all dr iver outputs low in the under in fixed time (20sec. nominal), and self-returns to th e normal operation. this circuit is enabled the volta ge force to vsp over the duty minimum voltage v spmin , and note that the motor cannot starts up when the controller doesn?t det ect the motor rotation by the minimum duty control. 16) internal voltage regulator the internal voltage regulator vreg is output for the bias of the hall element, the phase control setting. however, when using the vreg function, be aware of the i omax value. if a capacitor is connected to the ground in order to stabilize output, a 1f or lower capacitor should be used. in this case, be sure to confirm that there is no oscillation in the output. fig. 6 vreg output pin application example hup hun hvp hvn hwp hwn hu hv hw vcc controller ic r1 vreg / hb
6/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? timing charts (cw) fig. 7 BD62013FS (clockwise) timing charts pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm hall u pwm hall v hall w pwm pwm pwm uh pwm pwm pwm vh wh ul vl wl uh vh wh ul vl wl uh vh wh ul vl wl fg hall signals spin up (hall period < 5hz) cw direction (lead=0deg) cw direction (lead=30deg) fg output
7/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? timing charts (ccw) fig. 8 BD62013FS (counter clockwise) timing charts pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm hall u pwm hall v hall w pwm pwm pwm uh pwm pwm pwm vh wh ul vl wl uh vh wh ul vl wl uh vh wh ul vl wl fg hall signals spin up (hall period < 5hz) cw direction (lead=0deg) cw direction (lead=30deg) fg output
8/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? controller outputs and operation mode summary detected direction forward (cw:u~v~w, ccw :u~w~v) reverse (cw:u~w~v, ccw:u~v~w) conditions hall sensor period < 5hz 5hz < < 5hz 5hz < v sphb < vsp < v spmin (duty off) upper and lower arm off v spmin < vsp < v spmax (control range) 150 upper switching normal operation v sptst < vsp (testing mode) 120 upper and lower switching 150 upper switching (no lead angle) 120 upper and lower switching 120 upper switching overcurrent upper arm off upper and lower arm off uvlo tsd motor lock external input upper and lower arm off protect operation hall sensor abnormally upper and lower arm off and latch * the controller monitors both edge of three hall sensors for detecting period. * for the phase control f unction to operate is only 150 comm utation mode. however, the cont roller forces no lead angle when th e testing mode. ? absolute maximum ratings (ta=25c, all voltages are with respect to ground) ratings parameter symbol BD62013FS unit supply voltage v cc 20* 1 v duty control voltage v sp -0.3 to 20 v all others v i/o -0.3 to 5.5 v driver outputs i omax(out) 15* 1 ma monitor output i omax(fg) 5* 1 ma vreg outputs i omax(vreg) -40* 1 ma operating temperature t opr -40 to 110 c storage temperature t stg -55 to 150 c power dissipation pd 1.00* 2 w junction temperature t jmax 150 c *1 do not, however, exceed pd or aso. *2 mounted on a 70mm x 70mm x 1.6mm fr4 glass-epoxy board wi th less than 3% copper foil. de rated at 8mw/c above 25c. ? operating conditions (ta=25c) parameter symbol BD62013FS unit supply voltage v cc 10 to 18 v
9/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? electrical characteristics (unless otherwise specified, ta=25c and vcc=15v) limits parameter symbol min. typ. max. unit conditions power supply supply current i cc 1.3 2.5 5.0 ma vreg voltage v reg 4.5 5.0 5.5 v i o =-30ma driver outputs output high voltage v oh v reg -0.60 v reg -0.20 v reg v i o =-5ma output low voltage v ol 0 0.14 0.60 v i o =5ma dead time t dt 1.6 2.0 2.4 s minimum pulse width t min 0.8 1.0 1.2 s hall comparators input bias current i hall -2.0 -0.1 2.0 a v in =0v common mode input v hallcm 0 - v reg -1.5 v minimum input level v hallmin 50 - - mv p-p hysteresis voltage p v hallhy+ 5 13 23 mv hysteresis voltage n v hallhy- -23 -13 -5 mv duty control input bias current i sp 15 25 35 a v in =5v duty minimum voltage v spmin 1.7 2.1 2.5 v duty maximum voltage v spmax 5.0 5.4 5.8 v testing operation range v sptst 13 - 18 v minimum output duty d min 1.2 1.8 2.4 % f osc =18khz maximum output duty d max 92 95 98 % f osc =18khz hb enable voltage v sphb 0.5 1.0 1.5 v mode switch and the external input - ccw and fib input bias current i in -70 -50 -30 a v in =0v input high voltage v inh 3 - vreg v input low voltage v inl 0 - 1 v hysteresis voltage v inhy 0.2 0.5 0.8 v monitor output - fg output high voltage v monh v reg -0.40 v reg -0.08 v reg v i o =-2ma output low voltage v monl 0 0.06 0.40 v i o =2ma overcurrent protection input bias current i rcl -30 -20 -10 a v in =0v threshold voltage v rcl 0.48 0.50 0.52 v noise masking time t rcl 0.8 1.0 1.2 s phase control minimum lead angle p min - 0 1 deg v pc =0v maximum lead angle p max 29 30 - deg v pc =1/2v reg vsp controlled lead angle p vsp 23 26 29 deg v sp =4v,r pct /r pc =100k ? /96.97k ? osc carrier frequency f osc 16 18 20 khz r t =22k ? uvlo release voltage v uvh 8.5 9.0 9.5 v lockout voltage v uvl 7.5 8.0 8.5 v hysteresis voltage v uvhy 0.5 1.0 1.5 v
10/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) fig.11 vreg drive capability fig.12 high side output voltage (xh, xl) fig.9 circuit current fig.10 vreg vs vcc 0 1 2 3 4 9 12151821 supply voltage : vcc [v] circuit current : i cc [ma] 110c 25c -40c 4.6 4.8 5.0 5.2 5.4 9 12151821 supply voltage : vcc [v] vreg voltage : v reg [v] 25c 110c -40c 4.6 4.8 5.0 5.2 5.4 0 10203040 output current : i out [ma] vreg voltage : v reg [v] 25c 110c -40c -1.6 -1.2 -0.8 -0.4 0.0 0 4 8 12 16 output current : i out [ma] output drop voltage : ? voh [v] -40c 25c 110c
11/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) - continued fig.15 hall comparator hysteresis voltage fig.16 vsp input bias current fig.13 low side output voltage fig.14 hall comparator input bias current (xh, xl) (hxp, hxn) 0.0 0.4 0.8 1.2 1.6 0 4 8 12 16 output current : i out [ma] output voltage : vol [v] _ 110c 25c -40c -0.20 -0.15 -0.10 -0.05 0.00 01234 input voltage : v inhxp [v] input bias current : i hall [a] 110c 25c -40c -1 0 1 2 3 4 5 6 -30 -15 0 15 30 differential voltage : v hup -v hun [mv] output voltage : v wh [v] 110c 25c -40c 110c 25c -40c 0 50 100 150 200 0 5 10 15 20 vsp voltage : vsp [v] input bias current : i sp [a] 110c 25c -40c
12/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) - continued fig.19 high side output voltage fig.20 low side output voltage (fg) (fg) fig.17 output duty ? vsp voltage fig.18 testing mode threshold voltage 0 20 40 60 80 100 02468 vsp voltage : vsp [v] output duty : d sp [%] 110c 25c -40c -0.5 0.0 0.5 1.0 1.5 0 5 10 15 20 vsp voltage : vsp [v] internal logic : h/l [-] 110c 25c -40c -0.8 -0.6 -0.4 -0.2 0.0 0246 output current : i out [ma] output drop voltage : ? voh [v] -40c 25c 110c 0.0 0.2 0.4 0.6 0.8 0246 output current : i out [ma] output voltage : vol [v] _ 110c 25c -40c
13/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) - continued fig.23 rcl input bias current fig.24 rcl input threshold voltage fig.21 input bias current fig.22 input threshold voltage (ccw, fib) (ccw, fib) 0 10 20 30 40 50 60 012345 input voltage : v in [v] input bias current : i in [a] 110c 25c -40c -0.5 0.0 0.5 1.0 1.5 1.71.92.12.32.52.72.9 input voltage : v in [v] internal logic : h/l [-] 110c 25c -40c 110c 25c -40c 0 10 20 30 012345 rcl input voltage : v rcl [v] rcl input bias current : i rcl [a] 110c 25c -40c -0.5 0.0 0.5 1.0 1.5 0.48 0.49 0.50 0.51 0.52 input voltage : v rcl [v] internal logic : h/l [-] 110c 25c -40c
14/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) - continued fig.27 thermal shut down fig.28 under voltage lock out (vcc) fig.25 hb enable voltage fig.26 hb output drive capability -0.5 0.0 0.5 1.0 1.5 125 150 175 200 junction temperature : tj [c] internal logic : h/l [-] 0 1 2 3 4 5 6 7.0 7.5 8.0 8.5 9.0 9.5 10.0 supply voltage : vcc [v] uh voltage : v uh [v] 110c -40c 25c - 40c 110c 25c 0 1 2 3 4 5 6 0.0 0.5 1.0 1.5 2.0 vsp voltage : vsp [v] hb output voltage : v hb [v] _ 110c 25c -40c 110c 25c -40c -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0 10203040 hb output current : i hb [ma] hb drop voltage : ? v hb [v] -40c 25c 110c
15/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) - continued fig.31 pc voltage normalized - lead angle fig.32 carrier frequency - rt fig.29 vsp-pct offset voltage fig.30 pct-pc linearity (r pct =r pc =100k ? ) 0 10 20 30 40 50 60 0.00.20.40.60.81.0 v pc /v reg (normalized) : [v/v] phase : la [deg] 110c 25c -40c 0 1 2 3 4 5 01234567 vsp voltage : vsp [v] pct voltage : v pct [v] 110c 25c -40c 10 15 20 25 30 14 18 22 26 30 external resistor : r t [kohm] frequency : f osc [khz] 110c 25c -40c 0 1 2 3 4 01234 pct voltage : v pct [v] pc voltage : v pc [v] 110c -40c 25c
16/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? application circuit example fig.33 application circuit example (150 commutation driver) parts list parts value manufacturer type parts value ratings type ic1 - rohm BD62013FS c1 0.1f 50v ceramic ic2 - rohm bm6201fs c2~4 2200pf 50v ceramic r1 1k ? rohm mcr18ezpf1001 c5 10 ? f 50v ceramic r2 150 ? rohm mcr18ezpj151 c6 10 ? f 50v ceramic r3 22k ? rohm mcr18ezpf2202 c7~9 1f 50v ceramic r4 100k ? rohm mcr18ezpf1003 c10 0.1f 50v ceramic r5 51k ? rohm mcr18ezpf5102 c11 1f 50v ceramic r6 0.5 ? rohm mcr50jzhfl1r50 x 3 c12 100pf 50v ceramic r7 10k ? rohm mcr18ezpf1002 c13 0.1f 630v ceramic r8 0 ? rohm mcr18ezpj000 c14 0.1f 50v ceramic q1 - rohm dtc124eua c15 1f 50v ceramic d1 - rohm kdz20b hx - - hall elements r8 vreg vreg c5 hu hv hw vsp fg dtr vcc gnd m vdc ic1 ic2 r1 r2 r3 r4 r5 r6 r7 q1 c1 c2~c4 c6 c7 c8 c9 c10 c11 c12 c13 d1 c14 c15
17/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? interfaces fig.34 rt fig.35 rcl fig.36 vsp fig.37 vreg, vcc fig.38 xh, xl, fg fig.39 hb fig.40 hxp, hxn fig.41 ccw, fib fig.42 pc, pct uh,vh,wh vreg ul,vl,wl fg hup hun 2k hvp hvn hwp hwn vreg hb rt 2k rcl 250k vreg vreg 100k vsp 100k vcc vreg vreg 100k ccw fib vreg pc pct 2k 2k 2k
18/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? notes for use 1) absolute maximum ratings devices may be destroyed when supply voltage or operating te mperature exceeds the absolute maximum rating. because the cause of this damage cannot be identified as, for example, a short circuit or an op en circuit, it is important to consider circuit protection measures - such as adding fuses - if an y value in excess of absolute maximum ratings is to be implemented. 2) electrical potential at gnd keep the gnd terminal potential to the minimum potential un der any operating condition. in addition, check to determine whether there is any terminal that pr ovides voltage below gnd, including the voltage during transient phenomena. however, note that even if the voltage does not fall below g nd in any other operating condit ion, it can still swing below gnd potential when the motor generat es back electromotive force at the rcl termin al. the chip layout in this product is designed to avoid this sort of electrical potential problem, but pulling excessive current may still result in malfunctions. therefore, it is necessary to observe oper ation closely to conclusively confirm that there is no problem in actual operation. if there are a small signal gnd and a high current gnd, it is recommended to sepa rate the patterns for the high current gnd and the small signal gnd and provide a pr oper grounding to the reference point of the set not to affect the voltage at the small signal gnd with the change in voltage due to resist ance component of pattern wiring and high current. also for gnd wiring pattern of the component exte rnally connected, pay special attenti on not to cause undesirable change to it. 3) driver outputs the high voltage semiconductor generally driven by this produc t is connected to the next stage via the controller. if any special mode in excess of absolute maximum ratings is to be impl emented with this product or its application circuits, it is important to take physical safety measures, such as providing voltage clamping diodes or fuses. 4) thermal design use a thermal design that allows for a sufficient margin in lig ht of the power dissipation (pd) in actual operating conditions. 5) inter-pin shorts and mounting errors use caution when positioning the ic for mounting on print ed circuit boards. the ic may be damaged if there is any connection error or if pins are shorted together. also, connecti ng the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting t he power supply lines, such as establishing an external diode between the power supply and t he ic power supply pin. 6) operation in strong electromagnetic fields using this product in strong electromagnet ic fields may cause ic malfunctions. us e extreme caution with electromagnetic fields. 7) testing on application boards when testing the ic on an application board, connecting a capacitor to a low impedance pin subjects the ic to stress. always discharge capacitors after each process or step. always turn the ic's power supply off before connecting it to or removing it from a jig or fixture during the inspection pr ocess. ground the ic during assembly steps as an antistatic measure. use similar precaution w hen transporting or storing the ic. 8) regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elem ents, in order to keep them isolated. p-n junctions are formed at the intersection of these p layers with the n layers of other elements, creating a parasitic diode or transistor. for example, the relati on between each potential is as follows: when gnd > pin a and gnd > pin b, the p- n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic . the operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfuncti ons and physical damage. ther efore, do not use methods by which parasitic diodes operate, such as applying a voltage lo wer than the gnd (p substrate) voltage to an input pin. status of this document the japanese version of this document is formal specification. a customer may use this translation version only for a reference to help read ing the formal version. if there are any differences in translation version of this document formal version takes priority. resistor transistor (npn) n n n p + p + p p substrate gnd parasitic elemen t pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a pin b other adjacent elements e b c gnd parasitic element appendix: example of monolithic ic structure parasitic element
19/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? ordering information ? physical dimension, tape and reel information ? marking diagram 1pin mark lot no. product name ssop-a24 (top view) BD62013FS b d 6 2 0 1 3 f s - e 2 rohm part number package fs : ssop-a24 packaging specification e2 : embossed taping
20/20 datasheet d a t a s h e e t BD62013FS tsz02201-0828abb00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 01.jun.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? revision history date revision changes 01.jun.2012 001 new release
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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